Taiwan Patent Certificate
| No. | Patent Title | Patent Number | Country |
| 1 | Heat Dissipation Component | M529832 | Taiwan |
| 2 | Electronic Device and Its Heat Sink | M530014 | Taiwan |
| 3 | Radiative Heat Dissipation Type Electronic Device | M532141 | Taiwan |
| 4 | Graphite Material Heat Dissipation Sheet | I612270 | Taiwan |
| 5 | Radiative Heat Dissipation Structure of Printed Circuit | M541700 | Taiwan |
| 6 | Graphite Material Heat Dissipation Sheet | M547096 | Taiwan |
| 7 | Directional Heat Dissipation Structure of Electronic Device | M541701 | Taiwan |
| 8 | Manufacturing Method of Graphene-Metal Composite Material | I685573 | Taiwan |
| 9 | Heat Dissipation Structure of Electronic Device | I697271 | Taiwan |
| 10 | Molded Heat Transfer Component with Vapor Chamber and Its Forming Method | I696542 | Taiwan |
| 11 | Method for Modifying Metal with Graphene | I710522 | Taiwan |
| 12 | Graphene Gel Film and Manufacturing Method Thereof | I725726 | Taiwan |
| 13 | Signal Wire | M619976 | Taiwan |
| 14 | Graphene-Coated Copper Electronic Component | M628488 | Taiwan |
| 15 | Flip-Chip Packaging Structure | M629323 | Taiwan |
| 16 | Signal Wire and Manufacturing Method Thereof | I798729 | Taiwan |
| 17 | Electronic Component Packaging Substrate | I818542 | Taiwan |
| 18 | Flip-Chip Packaging Structure and Its Manufacturing Method | I825518 | Taiwan |
| 19 | Preparation Method for Graphene-Metal Composite Material | I868934 | Taiwan |
| 20 | Advanced Semiconductor Packaging Structure | I869154 | Taiwan |
Japanese Patent Certificate
| No. | Patent Title | Patent Number | Country |
| 1 | Graphite Material Heat Dissipation Sheet | 3216229 | Japan |
| 2 | Radiative Heat Dissipation Structure for Wireless Charging Device | 3220705 | Japan |
| 3 | Heat Dissipation Structure of Electronic Device | 3220706 | Japan |
| 4 | Radiative Heat Dissipation Type Electronic Device | 3223893 | Japan |
| 5 | Graphene-Coated Copper Electronic Component | 3236168 | Japan |
| 6 | Graphene-Metal Composite Material, Target, and Electromagnetic Shielding Packaging Component | 7585384 | Japan |
U.S. Patent Certificate
| No. | Patent Title | Patent Number | Country |
| 1 | Graphene Modification Method for Metals | US11,655,521 B2 | USA |
German Patent Certificate
| No. | Patent Title | Patent Number | Country |
| 1 | Graphene-Coated Copper Electronic Component | 202021106722 | Germany |
