About

History and progress summary

• 2015/10 : ACOOL Founded. The first product is graphene thermal dissipation film named Bifrost
• 2016: Applied 7 patents and got Qualcomm global part number. Beginning to develop graphene coating material for thermal dissipation.
• 2017: Applied 4 patents, graphene heat sink modules design into Telstra and Arris.
  Got investment from HCG and Lota group.
• 2018: Got Taipei R&D Excellence Award. Beginning to research and develop the graphene modified copper. Bifrost product design into TPV successfully.
• 2019: Proved the thermal conductivity of graphene modified copper. Got the invention patent of ACOOL COPPER.
• 2020: Test and proved the excellent electronic conductivity of ACOOL COPPER. Applied the second invention patent on graphene modified copper.
• 2021: Built up factory to mass produce ACOOL COPPER in Taiwan.
• 2022: Proved the magnetic sputtering with ACOOL Copper will improve electronic conductivity and EMI shield effectiveness.
• 2023: Proved low temperature resistance coefficient of ACOOL COPPER, high voltage and temperature resistance, and excellent IMC bonding interface
• 2024：Mass production of ACOOL COPPER ALC, AMC, and AHC with different graphene density; and special ACOOL COPPER AUC and AUS materials used to replace silver contacts.